Will An Adhesion Promoter Prevent Delamination in Power Semiconductor Packages?

Sophie Olson | Amkor Technology
Will An Adhesion Promoter Prevent Delamination in Power Semiconductor Packages?

Power semiconductor packages are used in high-temperature, high voltage environments. With the increase of electric vehicles (EVs) and hybrid electric vehicles (HEV) in the automotive market, demands on (and for) power packages have been growing. Packages for automotive applications must pass extensive testing for safety, therefore, packaging reliability is essential. As more power semiconductor packages are used in automotive applications, it is increasingly important the package has zero delamination.

Challenge of Delamination-free Semiconductor Power Packages

Semiconductor packages consist of several different materials. Each material has a different property, such as its coefficient of thermal expansion (CTE). With these different properties, passing extreme testing and achieving a real “zero delamination” is a challenging task for semiconductor manufacturers.

There are four major interfaces for a typical power package structure. The D2PAK (TO-263 as the JEDEC standard) package provides an example of these interfaces (Figure 1 and Figure 2). Designed for low on-resistance and high-speed switching MOSFETs, the D2PAK is suitable for high-power applications. It is used in motor drivers, power supply circuits and DC-DC converters.

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Published By Amkor Technology, Inc. on 20/05/2021