Aehr Receives Over $2.3 Million Follow-on Order for FOX-XP™ System for High Volume Wafer Level Production Test and Burn-In of Silicon Carbide Devices
published in Testing on 01/06/2021
FREMONT, Calif., June 01, 2021 - Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of semiconductor test and reliability qualification equipment, today announced it has received and shipped a follow-on order totaling more than $2.3 million from its lead silicon carbide customer for a FOX-XP Wafer Level Test and Burn-in system for high volume production test and burn-in of the customer’s line of silicon carbide devices. This system shipped during Aehr’s fiscal fourth quarter that ended May 31, 2021.
This customer is a leading Fortune 500 supplier of semiconductor devices with a significant customer base in the automotive semiconductor market, and is using Aehr’s FOX-XP system for high volume production burn-in and infant mortality screening of silicon carbide devices at wafer level for electric vehicle power modules. The FOX-XP system is configured to test eighteen silicon carbide wafers in parallel while contacting and testing 100% of the devices on each wafer.
Gayn Erickson, President and CEO of Aehr Test Systems, commented, “This follow-on order for an additional FOX-XP system is the result of our working closely with this lead customer to achieve their test requirements and validation of our FOX-P platform and WaferPak full wafer contactors as their production qualified solution. We expect this customer will order a full set of WaferPaks for this system in our new fiscal year that just began, and a significant number of FOX systems, WaferPaks and related consumables that they have forecasted to purchase from Aehr over the next several years.
“In addition, we remain engaged in promising discussions with multiple key companies in the silicon carbide space, some of which have also publicly indicated plans for significant capacity increases.
“Silicon carbide continues to be promising as a key growth driver for Aehr, and we anticipate that silicon carbide wafer level burn-in will become the industry standard for low cost and 100% traceability for burn-in and reliability screening. The power semiconductor market for electric vehicles is expected to triple between 2020 and 2026, growing at a 25.7% CAGR to $5.6 billion, according to a March 2021 report from Yole Développement research. In addition, a July 2020 report from Deloitte forecasts total EV sales will grow from 2.5 million in 2020 to 11.2 million in 2025, a CAGR of 29%, before reaching 31.1 million by 2030 and securing approximately 32% of the total market share for new car sales.”
The FOX-XP system, available with multiple WaferPakTM Contactors (full wafer test) or multiple DiePakTM Carriers (singulated die/module test) configurations, is capable of functional test and burn-in/cycling of integrated devices such as silicon carbide power devices, silicon photonics as well as other optical devices, 2D and 3D sensors, flash memories, Gallium Nitride (GaN), magnetic sensors, microcontrollers, and other leading-edge ICs in either wafer formfactor, before they are assembled into single or multi-die stacked packages, or in singulated die or module form factor.