Amkor Technology, Inc.

United States

Enabling the Future

2045 E. Innovation Circle
Tempe - 85284
United States

About Us

Amkor’s broad package portfolio includes leadframe, BGA, CSP and WLCSP products. MEMS, sensors and SiP packaging with unique development and high volume production requirements are also supported. Amkor’s MicroLeadFrame® and ChipArray® BGA packages have become industry standards as QFNs and FBGAs. Large scale and complex 2.5/3D system solutions are supported using High-Density Fan-Out (SWIFT®) technology. Amkor also provides high volume copper pillar bumping and Package-on-Package (PoP) assemblies found in many smart mobile products.

Services include package design and development, wafer probe and package test, wafer bumping and redistribution, package assembly and final test. Engineering services offer best-in-class thermal, electrical and mechanical modeling and characterization as well as design automation. Test engineering services range from test program development to full product characterization of packaged RF, mixed-signal, logic and memory devices.

As the provider of choice for semiconductor assembly and test, Amkor offers comprehensive manufacturing capability and scale along with a broad global presence.


Amkor experts located in our World Class Design Centers can work with customers to design and engineer top quality packaging for product requirements.

Whether the customer’s silicon is RF, mixed signal or high-speed digital, Amkor has the toolset and experience to optimize and fully characterize the package design.

Offering a vast array of test capabilities for a rich testing experience.

Leaders in wafer bumping and die-level interconnect technology.